The world's first no stroboscopic LED Solution
Package：
Ceramic Package
Size:
20X10 mm
Thickness:
2.0mm
Lead:
2 Leads
Application:
LED lighting
Feature:
No stroboscopic
1G Ethernet SoC FCBGA
Package：
FCBGA
Size:
15X15mm
Thickness:
1.0mm
Lead:
276 Balls
Application:
Industrial Ethernet
Feature:
Underfill, Metal lid
AI Processor FCBGA576
Package：
FCBGA
Size:
20X20 mm
Thickness:
1.0mm
Lead:
576 Balls
Application:
AI
Feature:
Underfill, Metal lid
Automotive 32bit MCU with QFN
Package：
QFN
Size:
5X5 mm
Thickness:
0.85mm
Lead:
32 Leads
Application:
Automotive
Feature:
AEC-Q100 qualified
Automotive SiC with TO
Package：
TO-247
Size:
15.8X21 mm
Thickness:
5mm
Lead:
3/4 Leads
Application:
Automobile
Feature:
AEC-Q100 qualified
PD GaN FET TOLL
Package：
TOLL
Size:
10X10 mm
Thickness:
2.3 mm
Lead:
8 Leads
Application:
PD fast charging
Feature:
Small size, high heat dissipation
RF Filter FCLGA
Package：
FCLGA
Size:
1.1X0.9 mm
Thickness:
0.4mm
Lead:
5 Leads
Application:
Mobile Phones, wearable
Feature:
ASSY level cavity
DC-DC μModule Package
Package：
BGA
Size:
9X15 mm
Thickness:
5.01mm
Lead:
77 Balls
Application:
FPGA, CPU Power supply
Feature:
High integration with components
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