New Products
New
Published: Dec,2023
Device: STOD31201
Description: 1G Ethernet PHY FCBGA
Features: Underfill, Metal lid
Device: STOD31201
Description: 1G Ethernet PHY FCBGA
Features: Underfill, Metal lid
New
Published: Jan,2024
Device: STOD40110
Description: Automotive MCU with QFN
Features: AEC-Q100 Qualified
Device: STOD40110
Description: Automotive MCU with QFN
Features: AEC-Q100 Qualified
New
Published: Mar,2023
Device: STOD40312
Description: Automotive SiC TO Package
Features: AEC-Q100 Qualified
Device: STOD40312
Description: Automotive SiC TO Package
Features: AEC-Q100 Qualified
New
Published: May,2024
Device: STOD40510
Description: DC-DC Step Down Power Module
Features: High Integration, including Controller, Power MOS, Inductors and support components
Device: STOD40510
Description: DC-DC Step Down Power Module
Features: High Integration, including Controller, Power MOS, Inductors and support components
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Assembly
Test
Design
Assembly
Covered numerous package forms (PDIP, SOP, QFP, QFN, LGA, BGA, Flipchip, WLCSP, Module, SiP, Ceramic, etc.) and provide Engineering lot, Hot lot, Mass Production services.
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Test
STO provides CP and FT services for Analog, Mixed Signal, RF, Memory and SoC platforms, as well as corresponding test program and spare parts development, to provide customers with highly competitive Turnkey services.
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Design
STO provides Substrate, Leadframe, PCB design service, Module and SiP simulation, Assembly reliability test service.
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