Assembly

Assembly

Package Portfolio

Engineering and MP

Customized Service

Key words:

Assembly

Classification:

Assembly

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  • Product Description
    • Commodity name: Assembly

    <p>Package Portfolio</p> <p>Engineering and MP</p> <p>Customized Service</p>

    Package Type

    Package Type PKG Size Reference Picture
    SOP SOP/SOP EP/SSOP/TSSOP/TSSOP EP/PDIP >2X2mm
    QFN QFN/VFQFN/WFQFN/DFN/SON/AQFN 0.3x0.6mm-12x12mm
    QFP LQFP/LQFP EP/TQFP/TQFP EP/TSOP(I) 7X7mm-20X20mm
    LGA LGA >1.0x0.7mm
    BGA FBGA/HSFBGA/PBGA 1.2X1.2mm-17x17mm
    FC FC SOP/FC QFN/FC LGA/FC BGA >1X1mm
    Module MCM/LGA Module/BGA Module >2x2mm
    Discrete TO/SOT/TOLL >2X2mm

    Engineering and Mass Production Services

    ● Engineering service flow

    ● Mass production flow

    Customization Service

    Package customization service.
    BOM customization service.
    Process flow customization service.
    Packing and shipment customization service.

这里是标题一h1占位文字

free hotline

Tel

+86-13813699059

E-mail

Mail

xiaojuan.wu@suntomicro.com

Address

Add

Room 907, Zhongxin Ecological Building, No.2 Keying Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province

R&D Company Address: 68 Innovation Road, Pudong New District, Shanghai（Under Construction）

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