Published: Dec,2023
Device: STOD31201
Description: 1G Ethernet PHY FCBGA
Features: Underfill, Metal lid
Device: STOD31201
Description: 1G Ethernet PHY FCBGA
Features: Underfill, Metal lid
Published: Jan,2024
Device: STOD40110
Description: Automotive MCU with QFN
Features: AEC-Q100 Qualified
Device: STOD40110
Description: Automotive MCU with QFN
Features: AEC-Q100 Qualified
Published: Mar,2023
Device: STOD40312
Description: Automotive SiC TO Package
Features: AEC-Q100 Qualified
Device: STOD40312
Description: Automotive SiC TO Package
Features: AEC-Q100 Qualified
Published: May,2024
Device: STOD40510
Description: DC-DC Step Down Power Module
Features: High Integration, including Controller, Power MOS, Inductors and support components
Device: STOD40510
Description: DC-DC Step Down Power Module
Features: High Integration, including Controller, Power MOS, Inductors and support components