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An important link in the semiconductor industry chain: a brief analysis of the wafer foundry industry


Release time:

2024-02-23

Wafer foundry, also known as chip foundry production, is the most important manufacturing link in the semiconductor industry.

Wafer foundry, also known as chip foundry production, is the most important manufacturing link in the semiconductor industry. Since the invention of integrated circuits by Texas Instruments in the late 1950 s, semiconductors have entered the era of integrated circuits. Early integrated circuits were concentrated in several large companies around the world, such as Intel, Texas Instruments, and Fairchild in the United States. Such enterprises in the field of integrated circuit design and manufacturing at the same time, known as the industry's IDM (vertically integrated manufacturing) company. Since the 1980 s, due to the wide application of computer aided application (CAD), integrated circuit design began to be separated from IDM, forming a group of five-factory semiconductor enterprises that independently provided design but did not have wafer manufacturing. In 1983, Altera and other fabless (chip design companies without chip production capacity) came into being. In the middle and late 1980 s, Mr. Zhang Zhongmou, senior vice president of the world who worked in Texas Instruments for many years, founded Taiwan integrated circuit manufacturing Co., Ltd. in Taiwan, announcing the birth of a new industry, wafer foundry. It is entirely for design services, can do IDM foundry, but also can do no factory semiconductor company foundry. In the following 30 years, the foundry industry has developed to the world.

Specifically, the wafer foundry service refers to the use of 8-inch (200mm in diameter) or 12-inch (300mm in diameter) silicon wafers as raw materials, through the mask carrying circuit information, the use of lithography and etching process, the chip design company's requirements of the circuit layout integrated on the wafer. The wafer is integrated layer by layer through multiple cycles of lithography and etching processes, and then a specific circuit structure is finally integrated on the wafer through ion implantation, annealing, diffusion, chemical vapor deposition, physical vapor deposition, chemical mechanical polishing and other processes.