DC-DC μModule Package
Key words:
DC-DC μModule Package
Classification:
- Product Description
-
- Commodity name: DC-DC μModule Package
- 封装类型:: BGA
- 封装尺寸:: 9X15 mm
- 封装厚度:: 5.01mm
- 引脚数量:: 77 Balls
- 应用场景:: FPGA, CPU Power supply
- 优势特点:: High integration with components