DC-DC μModule Package

Key words:

DC-DC μModule Package

Classification:

  • Product Description
    • Commodity name: DC-DC μModule Package
    • 封装类型:: BGA
    • 封装尺寸:: 9X15 mm
    • 封装厚度:: 5.01mm
    • 引脚数量:: 77 Balls
    • 应用场景:: FPGA, CPU Power supply
    • 优势特点:: High integration with components

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